Intern - MSB Process & Equipment Engineer

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Location Bendemeer, Singapore Department Assembly, Process and Equipment Engineering Project Title Assembly Output and Yield Optimization for Cost Improvement Project Description The Assembly Process and Equipment Engineering Intern will undertake an engineering project focused on improving assembly output, process yield, product quality, and manufacturing cost. Under the guidance of experienced engineers, the intern will study semiconductor assembly processes and apply engineering methodologies to identify process variations, analyze potential failure modes, and evaluate improvement opportunities. The project will include experimental planning, engineering data collection, statistical analysis, and effectiveness monitoring. The intern will also explore how data analytics, Generative AI, and Agentic AI can improve engineering analysis, technical documentation, and problem-solving workflows. Objective of the Project Identify assembly process factors that influence output, yield, product quality, reliability, and manufacturing cost. Apply structured engineering methods to investigate selected process or equipment-related opportunities. Develop and evaluate an improvement proposal using experimental data and statistical analysis. Explore AI-Enabled methods for accelerating data analysis, identifying patterns, or preparing engineering insights. Opportunities for Full Time Employment Interns may be considered for future internship or full-time employment opportunities based on business needs, role availability, academic completion, and demonstrated capabilities. Project Scope Study the operating principles and process controls of selected semiconductor assembly equipment under engineer guidance. Identify and analyze selected assembly process, equipment, or material-related opportunities using engineering data and structured problem-solving methods. Develop an experimental matrix and conduct controlled evaluations to determine factors affecting assembly output and yield. Apply data analytics to evaluate results, identify improvement opportunities, and formulate a technical proposal. Implement an approved project solution in a controlled setting and monitor its effectiveness against defined engineering indicators. Learning Opportunities Gain practical knowledge of semiconductor assembly processes, equipment principles, process controls, and product-quality requirements. Learn how to apply Failure Mode and Effects Analysis, Eight Disciplines problem solving, Design of Experiments, and root-cause analysis. Develop experience in Statistical Process Control and Fault Detection and Classification methodologies. Strengthen engineering data analysis, technical documentation, visualization, and presentation skills. Explore Generative AI, Agentic AI, and AI Assistant tools for data exploration, analysis, workflow improvement, and engineering productivity. Deliverables An experimental plan identifying the process factors, evaluation method, data requirements, and success criteria. A structured analysis of process, equipment, or material data related to assembly output and yield. A technical proposal recommending an improvement to the selected assembly process. An effectiveness-monitoring summary comparing results against the established project indicators. Impact of the Project Improve understanding of the process factors influencing assembly output and product yield. Identify a data-driven opportunity for process, equipment, or material optimizati