TDT CMOS PI

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Additional Responsibilities Align TDT CMOS Device development and transfer objectives with Technology Development sites. Drive and ensure close collaboration with Design, TCAD, Modeling, and Product Engineering groups across Micron sites. Collaborate with process integration module owners and process owners to drive electrical characterization of CMOS devices and CMOS circuits and identify device improvement opportunities. Utilize technology development and transfer knowledge to develop new technology nodes to mature manufacturing capability while achieving key program metrics. Ensure CMOS devices meet electrical, performance, power, variability, and reliability targets required for product success. Drive close collaboration with device and process integration development groups at other Technology Development sites. Collaborate closely with manufacturing fabs to facilitate successful technology transfer and production ramp. Contribute to the fundamental understanding of CMOS technology and its impact on overall product figures of merit. Lead cross-functional exploration and development of future CMOS device architectures, including non-planar transistor technologies, by partnering with Device, TCAD, Process Integration, Design, and Manufacturing teams to enable future DRAM technology roadmaps. Drive adoption of AI, machine learning, advanced analytics, and engineering automation solutions to accelerate technology development, root-cause analysis, model generation, and engineering decision-making. Develop and deploy digital methodologies that improve engineering efficiency, data utilization, and development cycle time. Skills Required / Qualifications (Candidates are not expected to meet all requirements) Education PhD or Master's degree in Electrical Engineering, Physics, Microelectronics, Materials Science, or a related field. Technical Qualifications Minimum 5 years of semiconductor industry experience with expertise in CMOS device design, process integration, and fabrication technologies. DRAM experience is highly desirable. Strong understanding of semiconductor device physics, transistor fundamentals, process integration, variability, reliability, and characterization techniques. Experience using process and device TCAD simulation tools (Synopsys Sentaurus or equivalent). Experience with data analysis tools such as JMP, CEDA, Python, MATLAB, or equivalent. Experience with DOE methodologies and statistical analysis techniques. Familiarity with advanced CMOS architectures, scaling challenges, and emerging transistor technologies is highly desirable. Experience driving technology development and transfer programs in a manufacturing environment. AI & Digital Engineering Qualifications Experience applying AI, machine learning, data science, or advanced analytics techniques to semiconductor technology development, process optimization, or engineering problem-solving is preferred. Proficiency in Python, data analytics, automation frameworks, or large-scale data mining methodologies is highly desirable. Experience developing automated engineering workflows, dashboards, predictive models, or AI-assisted solutions is a plus. Ability to leverage Generative AI tools and engineering copilots to improve productivity, technical communication, and development efficiency. Passion for applying emerging AI technologies to transform semiconductor development and manufacturing workflows. Professional Skills Strong technical leadership and problem-solving skills. Ability to lead complex cross-functional initiatives and influence stakeholders across organizations. Strong written and verbal English communication skills. Mandarin fluency preferred.