晶圓廠製程工程師 Fab Process Engineer

Micron Technology · Miaoli - Tongluo, Taiwan

onsitefull-time3-6 years

posted 19h

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 在美光( Micron ),我們打造記憶體與儲存解決方案,驅動著改變世界運作、學習與連結方式的各項技術。我們正在尋找充滿熱忱的人才加入團隊,為半導體 產業的成長與創新貢獻心力。 身 為製程工程師,您將開發、優化並維護半導體製程,持續提升良率、品質、成本效益與生產力;同時解決複雜的技術挑戰,並與設備、整合、製造及供應商團隊跨部門合作。 作為美光( Micron ) AI 智慧製造 生態系的一環,晶圓廠製程工程師會運用 AI 輔助製程監控、 SPC/FDC 洞察與資料分析,提升晶圓製造的製程穩定性、良率、品質、成本 效益 與生 產力。 At Micron, we create memory and storage solutions that power the technologies transforming how the world works, learns , and connect . We are looking for passionate individuals to join our team and help drive growth and innovation across the semiconductor industry. As a Process Engineer, you will develop, optimize , and sustain semiconductor manufacturing processes to continuously improve yield, quality, cost efficiency, and productivity. You will solve complex technical challenges and collaborate cross-functionally with Equipment, Integration, Manufacturing, and Supplier teams to drive operational excellence. As part of Micron’s AI-enabled smart manufacturing ecosystem, Fab Process Engineers leverage AI-assisted process monitoring, SPC/FDC insights, and advanced data analytics to enhance process stability, improve yield and quality, optimize cost efficiency, and maximize manufacturing productivity across wafer fabrication operations. 工作職責(RESPONSIBILITIES) 開發、優化及維護晶圓製造製程,以提升良率、品質、成本效益 與 生 產 效率 。 推動單站點(Process Step)製程改善與評估。 主導 產 線持續改善專案 。 運用 結構 系統 化方法( FMEA 、 8D 、 SPC 、 FDC ) 分析良率與缺陷問題。 診斷根本原因,並將生 產停機時間降至最低。 運用資料分析預防問題反覆發生。 運用 SPC 、 FDC 與 APC 追蹤製程表現並偵測製程 偏移 異常趨勢 。 管理製程驗證與製程 控 制計畫。 確保生 產 週期 、產能與產品品質。 驗證新世代製程技術導入的準備狀況 解決量產擴充階段 的技術挑戰 達成新產 品導入及 產 能提升期間的生 產 目標 與設備、整合、製造及品質團隊合作。 解決影響良率、 產能與品質的 相關 問題。 向利害關係人溝 通技術發現 與 改善 建議。 Develop, optimize , and sustain wafer fabrication processes to improve yield, quality, cost efficiency, and manufacturing productivity. Drive process-step improvement initiatives and process evaluations. Lead continuous improvement projects within the manufacturing environment. Apply structured problem-solving methodologies, including FMEA, 8D, SPC, and FDC, to analyze yield excursions and defect-related issues. Diagnose root causes and minimize production downtime. Leverage data analysis to prevent recurring issues and improve process stability. Monitor process performance and identify process drift or abnormal trends using SPC, FDC, and APC. Manage process qualification activities and process control plans. Ensure cycle time, production capacity, and product quality objectives are achieved. Validate readiness for the introduction of next-generation process technologies. Resolve technical challenges associated with high-volume manufacturing ramp and production scaling. Achieve manufacturing targets during new product introduction (NPI) and capacity expansion phases. Collaborate closely with Equipment, Integration, Manufacturing, and Quality teams. Resolve issues impacting yield, throughput, and product quality. Communicate technical findings, analyses, and improvement recommendations to stakeholders. 基本要求(MINIMUM REQUIREMENTS) 具相關技術領域之學士學位 以上 、進階專業證照、同等技術軍職經驗 , 或其他足以展現相關能力與專業經驗的同等資格。 優先考量科系: 化學工程, 電機工程, 材料科學 , 化學, 物理 , 機械工程, 工業工程 在需要時 穿戴個人防護裝備( PPE )與無塵室服裝 Minimum Qualifications Bachelor's degree or higher in a relevant technical discipline, advanced professional certification, equivalent military technical experience, or an equivalent combination of education, skills, and professional experience demonstrating the required competencies. Preferred Majors: Chemical Engineering, Electrical Engineering, Materials Science, Chemistry, Physics, Mechanical Engineering, Industrial E