RDA Application Engineer

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 工作職責（RESPONSIBILITIES） 開發、優化及維護晶圓製造製程，以提升良率、品質、成本效益 與 生 產 效率 。 推動單站點（Process Step）製程改善與評估。 主導 產 線持續改善專案 。 運用 結構 系統 化方法（ FMEA 、 8D 、 SPC 、 FDC ） 分析良率與缺陷問題。 診斷根本原因，並將生 產停機時間降至最低。 運用資料分析預防問題反覆發生。 運用 SPC 、 FDC 與 APC 追蹤製程表現並偵測製程 偏移 異常趨勢 。 管理製程驗證與製程 控 制計畫。 確保生 產 週期 、產能與產品品質。 驗證新世代製程技術導入的準備狀況 解決量產擴充階段 的技術挑戰 達成新產 品導入及 產 能提升期間的生 產 目標 與設備、整合、製造及品質團隊合作。 解決影響良率、 產能與品質的 相關 問題。 向利害關係人溝 通技術發現 與 改善 建議。 Develop, optimize , and sustain wafer fabrication processes to improve yield, quality, cost efficiency, and manufacturing productivity. Drive process-step improvement initiatives and process evaluations. Lead continuous improvement projects within the manufacturing environment. Apply structured problem-solving methodologies, including FMEA, 8D, SPC, and FDC, to analyze yield excursions and defect-related issues. Diagnose root causes and minimize production downtime. Leverage data analysis to prevent recurring issues and improve process stability. Monitor process performance and identify process drift or abnormal trends using SPC, FDC, and APC. Manage process qualification activities and process control plans. Ensure cycle time, production capacity, and product quality objectives are achieved. Validate readiness for the introduction of next-generation process technologies. Resolve technical challenges associated with high-volume manufacturing ramp and production scaling. Achieve manufacturing targets during new product introduction (NPI) and capacity expansion phases. Collaborate closely with Equipment, Integration, Manufacturing, and Quality teams. Resolve issues impacting yield, throughput, and product quality. Communicate technical findings, analyses, and improvement recommendations to stakeholders. 基本要求（MINIMUM REQUIREMENTS） 具相關技術領域之學士學位 以上 、進階專業證照、同等技術軍職經驗 ， 或其他足以展現相關能力與專業經驗的同等資格。 優先考量科系: 化學工程, 電機工程, 材料科學 , 化學, 物理 , 機械工程, 工業工程 在需要時 穿戴個人防護裝備（ PPE ）與無塵室服裝 Minimum Qualifications Bachelor's degree or higher in a relevant technical discipline, advanced professional certification, equivalent military technical experience, or an equivalent combination of education, skills, and professional experience demonstrating the required competencies. Preferred Majors: Chemical Engineering, Electrical Engineering, Materials Science, Chemistry, Physics, Mechanical Engineering, Industrial Engineering, or related technical disciplines. Willing and able to wear required Personal Protective Equipment (PPE) and cleanroom attire as necessary in a semiconductor manufacturing environment. 基本資格條件 （MINIMUM QUALIFICATIONS） 可透過學歷、實習、研究、軍事 技術 訓練 、製造或專業經驗展現 半導體製程開發 製程流程與配方 ( Recipe) 管理 統計製程管制（ SPC ）與故障偵測與分類（ FDC ） 根本原因分析（ RCA） 失效模式與效應分析 （ FMEA ）、 8D 問題解決方法 製程及設備特性理解 資料分析與判讀 持續改善 能力 技術文件撰寫 能力 協作與團隊合作 學習敏捷度與適應力 主動積極與當責 分析思維 注重細節 有效溝通 顧客與利害關係人導向思維 Candidates may demonstrate the following competencies through education, internships, research, military technical training, manufacturing experience, or other relevant professional experience: Knowledge of semiconductor process development and optimization. Experience with process flow management and recipe control. Understanding of Statistical Process Control (SPC) and Fault Detection and Classification (FDC) methodologies. Familiarity with Root Cause Analysis (RCA), Failure Modes and Effects Analysis (FMEA), and 8D problem-solving techniques. Understanding of semiconductor process and equipment interactions. Ability to analyze, interpret, and draw conclusions from technical data. Strong continuous improvement and problem-solving mindset. Effective technical documentation and