Senior CAD Engineer

NXP Semiconductors · Bucharest

onsitefull-time6-10 years

posted 17 Jul

Ready to join the future of innovation in Crypto & Security at NXP? NXP Semiconductors enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, we are driving innovation in the secure connected vehicle, end-to-end security & privacy and smart connected solutions markets. Built on more than 60 years of combined experience and expertise, the company has 45,000 employees in more than 35 countries. Additional information can be found by visiting www.nxp.com . HW Solutions Competency Center (HWS-CC) is a central team within NXP’s Global Operations Engineering (GOE) organization responsible for design, manufacturing, compliance and supply chain operations of hardware boards. The team provides hardware solutions to all business units within NXP through its global presence in North America, EU and Asia. Board types include end-customer, Silicon validation, system solutions, Failure Analyses, and reliability application. As a key leader, the individual will lead and interact with all our business units, SoC, Applications, and even our end customers to ensure robust power designs are realized. Business Units include Automotive , Mobile, Communication Infrastructure ,Smart City/Home , Industrial, Enabling technologies . In this position, the candidate will also be responsible for driving ensuring the design solutions are consistent with the company strategy, commitments and goals. The position is based out of the India and the individual will work in conjunction with our other design centers in Romania, Mexico, China, and US to ensure high quality solutions realized for our end customers. Your Responsibilities: · Participate in reviews of layouts to improve products across the Hardware Solutions team · Perform PISI simulations when required. · Provide design expertise and regional support for BU silicon, application teams, and third parties as needed. · Ensure board designs are cost effective for their intended applications. · Provide technical oversight into the CAD team with respect to proper PCB layout design and best practices. · Ability to work independently and in a design team environment. · Improve core competency in board design technologies. · Engage and provide consultation to external customers on board design and best practices. Perform critical design reviews for key customer accounts as needed. · Excellent communication skills to work across organizational boundaries (Marketing, SoC, SW, Applications , Validation, PE/ TE etc). Your Profile: · Define architecture to implement layout design per Technical Requirements Document (TRD) · Full ownership and leadership in the area of HW design, both at the board and system level. · Implement designs that are competitive with industry standards, high quality, cost effective, and delivered on time. · Critical out-of-the-box thinking and problem-solving skills. · Planning, organizing, decision-making & communication skills. · Ability to adapt to a dynamic and changing environment and business conditions. · Ability to work in a cross-functional team spanning various disciplines: Marketing, Sales, Development, System & Application Engineering, System Architecture, SW engineering, Silicon Validation teams, Design, Library/CAD, Layout, Product & Test Engineering. · Ability to prioritize and execute tasks and projects in a high-pressure environment. · Drive innovations in design process and design IP reuse and provide training and promotion for new technologies and methodologies to teams. · Ability to articulate and communicate with internal and external stakeholders. · Working knowledge of LPDDR4, LPDDR5, Ethernet, PCIe, USB, UART, I2C, SPI, CAN, SDHC, eMMC, other high-speed serial and parallel interfaces. · Knowledge and experience in RF communication using WiFi, BLE, NFC, V2X, GSM and other RF low frequency communication · Good knowledg