Intern - ADTS ATI Process Integration Engineer

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Project Title NAND Structural Integration Analysis Using Inline Characterization Project Description This process integration internship provides structured training and practical experience in NAND semiconductor structural integration through inline characterization and data analysis. The intern will analyze relationships among structural parameters, process performance, probe yield, and device operation. The project will provide exposure to real-world semiconductor manufacturing challenges, statistical analysis, process monitoring, cross-functional integration, and approved Artificial Intelligence-Enabled analytical workflows. Objective of the Project Develop an understanding of NAND process integration flows, structural parameters, inline characterization, probe yield, and device operation. Analyze correlations between inline structural data, process performance, probe yield, and device behavior. Identify critical structural parameters and recommend appropriate inline monitoring specifications. Apply statistical and approved AI-Assisted analytical methods to improve data interpretation and engineering insight generation. Opportunities for Full Time Employment Interns may be considered for future internship or full-time employment opportunities based on business requirements, role availability, and the applicable recruitment process. Project Scope Study the NAND process integration flow and identify key structural parameters relevant to process and device performance. Analyze inline characterization data and evaluate its relationship with process performance, probe yield, and device operation. Identify critical structural characteristics and define recommended inline monitoring specifications or control indicators. Collaborate with engineering subject matter experts from multiple process areas to understand cross-functional integration and validate analytical findings. Learning Opportunities Gain practical exposure to NAND process integration, inline characterization, probe testing, yield analysis, and device-performance concepts. Learn to use statistical-analysis and visualization methods to identify correlations among structural, process, yield, and device data. Develop familiarity with JMP and approved AI-Assisted tools for data exploration, pattern identification, visualization, and technical documentation. Collaborate with cross-functional engineering teams and learn how analytical findings are translated into process-monitoring recommendations. Deliverables A quantitative analysis of correlations between inline structural parameters, probe yield, and device performance. A documented proposal identifying key inline monitoring parameters and recommended specifications. A structured technical report covering the methodology, analytical results, validated AI-Assisted insights, findings, limitations, and recommendations. A final presentation communicating project outcomes, engineering impact, and potential future improvement opportunities. Impact of the Project Improve understanding of the relationship between NAND structural parameters and device performance. Strengthen inline process monitoring and data-informed engineering decision-making. Identify opportunities to improve process control and probe-yield performance. Establish a structured analytical approach that may inform future NAND integration studies. Skillsets Required Basic knowledge of semiconductor devices, manufacturing processes, or process integration. Strong ana